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HONG KONG, Nov. 21, 2025 /PRNewswire/ -- Hon Hai Tech Day will take place on November 21–22 at the Nangang Exhibition Center, spotlighting "The Real-World Applications of Hon Hai's Three Major Intelligent Platforms Combined with AI Technologies." The event will fully showcase the Group's latest advances in AI innovation.
FIT Hon Teng (6088.HK), a subsidiary of Hon Hai Precision Industry Co., Ltd. (2317-TW) specializing in connector manufacturing, will present a comprehensive lineup of high-speed connectors, power solutions, and liquid-cooling technologies, highlighting the advantages of the Foxconn Group's vertically integrated ecosystem.
This year, FIT is exhibiting high-speed server interconnects, power delivery solutions, and liquid-cooling products, including the 800V & ±400V Power Busbar for high-voltage systems, the 400A & 100A AC Whip Connectors and the 140kW LC Busbar & UQDB Floating Module for high-current applications. Among them, the 400A AC Whip Connector is the first of its kind in the market, designed to meet emerging requirements for high-power server racks. These technologies drew strong interest from leading CSP R&D teams and key customers during their debut at OCP, and FIT's LC Busbar and Power Busbar were successfully integrated into the NVIDIA MGX showcase wall.
Hon Hai Tech Day will be held on November 21–22 at the Nangang Exhibition Center in Taipei, featuring the Group's latest technological achievements and industry collaboration initiatives. FIT sincerely invites industry partners, media, and the public to visit the exhibition and witness the newest developments of the Hon Hai Technology ecosystem.
For more information about Hon Hai Tech Day (HHTD), please visit the official Hon Hai website: HHTD – Hon Hai Tech Day.
About Foxconn Interconnect Technology (FIT Hon Teng)
Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company's website at www.fit-foxconn.com
Media Contact: Product and Service Inquiries:
Email: fit-ir@fit-foxconn.com Europe and America Contact: sales-usa@fit-foxconn.com
View original content:https://www.prnewswire.com/apac/news-releases/fit-hon-teng-showcases-at-hon-hai-tech-day-demonstrating-the-foxconns-vertical-integration-strength-302622696.html
SOURCE Foxconn Interconnect Technology Ltd
HONG KONG, Sept. 10, 2025 /PRNewswire/ -- FIT Hon Teng (hereafter "FIT") will host the inaugural FIT Tech Day 2025 on September 17 at Syntrend Creative Park, 5th floor, in Taipei. This landmark event will bring together industry leaders, technical experts, and academic representatives to explore the future of smart mobility and automotive solutions.
The day will open with a keynote from FIT Chairman Sidney Lu on the theme "AI-Driven Smart Mobility," highlighting how efficient data and power flows are redefining mobility and enabling new models of cross-industry collaboration. FIT will also announce the integration of its two automotive business units under a single brand, "One Mobility," designed to strengthen competitiveness and create synergies through shared resources and a unified identity.
The program features forward-looking trend forums and keynote sessions spotlighting the disruptive impact of AI on smart mobility. International experts will share insights into the EV supply chain, mobility ecosystems, and automotive electronic architectures. Highlights include:
- Paul Gao, Chief Strategy Officer of Mercedes-Benz, and Andreas Tschiesner, Global Leader for Auto at McKinsey, in a dialogue on the future of the automotive industry.
- Keynote speakers: Tony Lin, Senior Vice President and Chief Consumer Business Officer at Taiwan Mobile; Max Cheng, CEO of VicOne; and Dr. Delphi Liu, former President of GM Taiwan, on how AI is transforming the automotive sector. Experts from Wistron, MTK Capital and NXP will also weigh in on these topics.
The exhibition area will showcase FIT's global innovation in smart mobility, offering inspiration and insight for professionals and visionaries alike. As the day winds down, discussions will continue into the evening with exclusive industry networking, fostering collaboration and opening new market opportunities.
Media, investors and industry professionals are warmly invited to join the event through the live stream link <Here> to gain first-hand insights into the future of smart mobility.
About Foxconn Interconnect Technology (FIT Hon Teng)
Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Asia. While connectors remain its core business, the company has strategically expanded in recent years to 5G Alot, Mobility and Audio, as well as entering consumer brand business. For more information, please visit the company's website at fit-foxconn.com
Media Contacts
Henry Chow Think Alliance Group | Sharon Teng Think Alliance Group |
View original content:https://www.prnewswire.com/apac/news-releases/fit-tech-day-2025-bringing-together-global-industry-leaders-and-technology-experts-to-shape-the-future-of-smart-mobility-302552195.html
SOURCE FIT Hon Teng Ltd