Amkor Technology, Inc.

Amkor Technology Inc. is a leading outsourced semiconductor assembly and test (OSAT) provider, specializing in advanced packaging and test services for the global semiconductor industry. The company offers a comprehensive portfolio including wafer bumping, wafer probe, package design, flip chip technologies, wafer-level fan-out packages, system-in-package solutions, leadframe and substrate-based wirebond packages, and micro-electro-mechanical systems (MEMS) packages. These services support applications in smartphones, data centers, artificial intelligence, automobiles, wearables, networking, storage, computing, power management, sensors, and solid-state drives. Amkor Technology Inc. delivers turnkey solutions from design and characterization to final testing and drop shipment, serving integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries across the United States, Japan, Europe, and Asia Pacific. Founded in 1968 and headquartered in Tempe, Arizona, it plays a critical role in the semiconductor supply chain as the world's largest U.S.-headquartered OSAT company.