Wiwynn Corporation

Accelerating Optical Scale-Up for Hyperscale AI Data Centers

TAIPEI, May 28, 2026 /PRNewswire/ -- Wiwynn, an innovative cloud IT infrastructure provider for data center, today announced it will unveil its latest Co-Packaged Optics (CPO) interconnect technologies at Computex 2026 (Nangang Exhibition Center Hall 1, Booth #J0106). The demonstration brings together ecosystem partners including Ayar Labs, Global Unichip Corp. (GUC), Browave, Corning Incorporated, FOCI, Molex, SENKO, and TE Connectivity. Together, the companies will present a full-stack path from chip-level CPO innovation to data center-scale deployment, marking a pivotal step forward for AI scale-up architectures.

As AI compute clusters continue to push the boundaries of performance, bandwidth, and power density, traditional copper interconnects are becoming a structural bottleneck for large-scale AI expansion. CPO technology addresses this challenge at its root by deeply integrating optical I/O with AI ASICs, fundamentally reducing signal loss and system power consumption, providing the critical foundation for next-generation AI scale-up.

"AI infrastructure is shifting toward optical-electrical convergence," said William Lin, President and CEO of Wiwynn. "Through close collaboration across our ASIC, silicon photonics, and fiber ecosystems, combined with Wiwynn's expertise in rack-level server integration and manufacturing, we are taking CPO technology from silicon-level innovation to system-ready architecture, accelerating real-world deployment and helping hyperscalers build next-generation AI data centers with higher bandwidth, improved power efficiency, and greater scalability."

With Ayar Labs: Bringing CPO into Deployable, Rack-Scale AI Infrastructure

Co-packaged optics is essential to AI scale-up as clusters grow beyond the limits of copper. To accelerate adoption, Wiwynn has formed a strategic partnership with CPO leader Ayar Labs. By integrating Ayar Labs' industry-leading TeraPHY™ optical engines and External Laser Small Form Factor Pluggable (ELSFP) SuperNova™ light sources into Wiwynn's rack-level architecture, the two companies are jointly delivering high-bandwidth, power-efficient CPO connectivity. Together, they are addressing key hyperscaler deployment challenges: fiber management, CPO-enabled AI ASIC integration, thermal management, power efficiency, and manufacturability.

"AI scale-up is driving step function demand for bandwidth, latency, and power efficiency across and between racks," said Mark Wade, CEO and co-founder of Ayar Labs. "Our work with Wiwynn brings co-packaged optics closer to hyperscale deployment by combining Ayar Labs' optical engines with Wiwynn's proven rack-level systems expertise. Together, we are laying the foundation for the next generation of AI infrastructure."

In-House Liquid-Cooling Solution: Ensuring Stable External Light Source

To meet CPO architecture's critical demand for stable external light sources, Wiwynn has engineered an in-house liquid-cooling solution specifically for ELSFP to ensure consistent laser output. Paired with a high-density in-chassis fiber routing, this design delivers highly reliable optical connectivity from the CPO ASICs to server system platforms, empowering hyperscalers to perfectly balance extreme AI compute performance with rigorous thermal management.

With GUC: Driving System-Level Integration from the Silicon Design phase

At the silicon and system architecture level, Wiwynn is collaborating with Global Unichip Corp. (GUC), the advanced ASIC leader, to incorporate system requirements early in the chip design phase. By holistically considering optical I/O, power delivery, and thermal design, this strategic approach reduces integration complexity, improves development efficiency, and accelerates the transition from chip-level innovation to system-ready AI infrastructure.

"The strategic collaboration with Wiwynn represents a fundamental shift in our R&D paradigm from silicon design phase to system-level intelligence." said Sean Tai, CEO of GUC. "This holistic approach significantly reduces integration complexity and accelerates the development cycles. It ensures that our AI infrastructure is industry-leading in terms of energy efficiency and deployment speed, providing our customers a definitive competitive edge in the global AI race."

A Complete Fiber Ecosystem: End-to-End Optical Connectivity from Chassis to Rack

Wiwynn also collaborates with a robust ecosystem of fiber and connectivity leaders, including Browave, Corning, FOCI, Molex, SENKO, and TE Connectivity, to bridge fiber routing and optical interconnect solutions within the server system to rack-level infrastructure. The exhibition features advanced technologies, highlighting Fiber Array Units (FAUs), high-density optical connectors, blind-mate interconnects, and fiber management systems.  This builds a complete optical interconnect solution from in-chassis to rack-level, accelerating the large-scale adoption of CPO technology in data centers.

Moving forward, Wiwynn remains committed to deepening its cross-layer ecosystem partnerships, leading the transition of CPO technology from validation to hyperscale volume deployment.

Ecosystem Partner Statements (in alphabetical order):

Browave

"Our in-depth collaboration with Wiwynn signifies market-leading recognition of Browave's R&D strength in Silicon Photonics and high-end CPO," said Victor Hwang, CEO of Browave. " Leveraging decades of technical heritage in optical communications and our strategic head start in the CPO market, Browave is honored to provide the core components that empower Wiwynn to showcase industry-leading innovations at Computex. Together, we are capturing the opportunities of the AI wave and continuing to drive the AI server market to new heights."

Corning

Claude Echahamian, vice president and general manager, emerging businesses and EMEA, Corning Optical Communications: "Co-packaged optics represents a fundamental shift in how optical connectivity is designed and deployed for large-scale AI systems. This is achieved through relationships across the ecosystem of companies that innovate to make this transformation a reality. Corning is pleased to work with Wiwynn in bringing robust and high-density fiber infrastructures within server trays and across racks for the latest generation of large-scale AI systems."

FOCI

"We are pleased to establish a strategic CPO partnership with Wiwynn," said D.D. Hu, General Manager of FOCI. "Leveraging our core optical interconnect technologies, developed through years of collaboration with the semiconductor industry, we will work together to address key challenges in silicon photonics packaging, including reflow compatibility and system pluggability. Together, we aim to reduce packaging complexity, enhance transmission architecture flexibility, and accelerate the deployment of next-generation AI optical communication infrastructure."

Molex

 "Molex is enabling the shift to optical interconnects for AI infrastructure through high-density connectivity solutions, and accelerating co-packaged optics adoption in next-generation data centers.", said Aldo Lopez, SVP at Molex."

SENKO

"Manufacturable and serviceable interconnect design is essential to scaling co‑packaged optics," said Kazu Takano, President and CBDO of SENKO Emerging Technologies Group. "As AI infrastructure transitions toward co‑packaged optics, reliable, high‑density optical connectivity becomes mission‑critical. Through our collaboration with Wiwynn, SENKO is supporting system‑level component integration including detachable FAUs with SEAT™ technology, and SN®-MT Very Small Form Factor (VSFF) interface connectivity, as shown in Wiwynn's COMPUTEX CPO system demonstration."

TE Connectivity

"Co-packaged optics is emerging as a foundational technology for next-generation AI infrastructure, and a strong ecosystem will be critical to advancing these solutions at scale," said Vishwas Rao, Senior Vice President and General Manager at TE Connectivity. "At TE, we bring deep expertise in high-density interconnects (including M x N arrayed high density FAUs), end-to-end signal and power solutions, and global manufacturing. We combine this with our next generation designs and processes to help customers deploy next-generation CPO architectures across AI data centers."

About WiwynnIT

Wiwynn is an innovative cloud IT infrastructure provider delivering high-quality computing, storage, and rack-level solutions for leading data centers worldwide. Guided by the vision to "unleash the power of digitalization; ignite the innovation of sustainability," Wiwynn actively invests in next-generation technologies to deliver the best TCO, workload- and energy-optimized IT solutions from cloud to edge. Wiwynn's end-to-end capabilities span server design, system integration, and high-volume L10/L11 rack delivery, backed by a manufacturing network spanning Taiwan, the United States, Mexico, Malaysia, and the Czech Republic.

For more information, please visit Wiwynn website, Facebook and Linkedin

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SOURCE Wiwynn

Presenting AI Compute, Liquid Cooling, Optical Scale-Up, and HVDC Power Delivery

TAIPEI, May 25, 2026 /PRNewswire/ -- Wiwynn (6669), an innovative cloud IT infrastructure provider for data centers, today announced to showcase its vision of next-generation data center designs at Computex 2026 (Booth #J0106, TaiNEX1). The exhibition spans cutting-edge rack-scale AI servers, developed with Wistron, breakthrough cooling technologies, optical scale-up designs, and high voltage DC (HVDC) power delivery architectures.

"AI is no longer just a compute challenge. It's a full-system engineering challenge. Compute, thermal management, data transmission, and power delivery must be co-designed at rack scale," said William Lin, President and CEO of Wiwynn. "At Computex, Wiwynn and our ecosystem partners present a full-stack, rack-scale technology blueprint, demonstrating our commitment to system design and integration excellence for data centers and cloud service providers worldwide."

Powering the AI Factory: Next-Generation AI Compute and Storage Systems

• NVIDIA Vera Rubin NVL72: Wiwynn and Wistron are among the first in line with readiness for the fully liquid-cooled, rack-scale platform unifying 72 NVIDIA Rubin GPUs and 36 NVIDIA Vera CPUs. Optimized for frontier AI model training, inference and reasoning, the platform delivers up to 10X higher performance per watt through extreme co-design —delivering breakthrough performance and efficiency for AI factories.
• AMD Helios rack-scale solution: Built on the OCP ORv3 Open Rack Wide (ORW) specification and powered by AMD Instinct™ MI400 Series GPUs, 6^th gen AMD EPYC™ CPUs, AMD Pensando™ networking technologies and the unifying AMD ROCm™ software stack, this pioneering AI platform is purpose-built for the world's most demanding workloads. Its open rack design enables superior power density, streamlined scaling, and simplified serviceability. As a trusted ODM partner, Wiwynn brings the AMD Helios platform from reference design to production, accelerating open, interoperable AI infrastructure for the next-generation hyperscale AI deployments.
• Storage: A storage server prototype providing aggregate high IOPs from 96 liquid-cooled E3.S SSDs, accessed with NVIDIA SCADA, using NVIDIA GPUs capable of saturating the PCIe connections to the drives for GNN and vector databases.

Rethinking Power: High Voltage DC (HVDC) Power Distribution:

As rack power density escalates, HVDC is becoming a foundational shift in data center architecture. Wiwynn, together with key ecosystem partners Delta and TE Connectivity (TE), showcases a rack level 800 VDC solution, spanning the power rack, liquid-cooled busbar, and an 800V-to-50V power distribution board (PDB), demonstrating the end-to-end HVDC system integration for high-density AI deployments.

Beyond Copper: Optical AI Scale-up with Co-Packaged Optics (CPO):

Bandwidth bottlenecks are the next frontier in AI infrastructure. Wiwynn collaborates with ecosystem partners, including Ayar Labs and GUC, to demonstrate a CPO-based optical scale-up rack design, integrating AI ASIC with 2.5D advanced package, TeraPHY™ optical engines, ELSFP SuperNova™ remote light sources, advanced fiber routing and optical interconnects. Wiwynn will also highlight its in‑house liquid‑cooling solution, purpose-built for ELSFP, ensuring reliable in‑chassis optical connections. This end-to-end demonstration marks a critical milestone in transitioning CPO from component-level innovation to hyperscale-ready deployment.

Breaking Thermal Barriers: Advanced Cooling innovation

As chip power envelopes reach new extremes, Wiwynn introduces two breakthrough cooling technologies:

• 6kW Double-sided Cold Plate with Liquid Metal TIM: Designed to support AI ASICs up to 6kW, this ultra-thin, double-sided liquid cooling solution integrates cavity PCB architecture to support Vertical Power Delivery (VPD), shorten power delivery paths and improve power delivery efficiency by more than 80% in a compact environment. With Liquid Metal TIM significantly reducing silicon-to-cold plate temperature differentials, the solution delivers over 30% gains in thermal efficiency.
• Diamond Composite Cooling: Wiwynn pushes material science boundaries with diamond composite, a next-generation thermal material offering superior thermal conductivity and a weight advantage over copper. Demonstrated in a microchannel cold plate design, diamond composite enhances cooling performance, addressing both thermal and structural challenges in high-density AI deployments, while unlocking promising potential for future IC package-level cooling applications.

Visit Wiwynn @Computex 2026 (Booth #J0106, TaiNEX1) to explore these innovative solutions driving the future of AI infrastructure and data center technologies.

About Wiwynn

Wiwynn is an innovative cloud IT infrastructure provider delivering high-quality computing, storage, and rack-level solutions for leading data centers worldwide. Guided by the vision to "unleash the power of digitalization; ignite the innovation of sustainability," Wiwynn actively invests in next-generation technologies to deliver the best TCO, workload- and energy-optimized IT solutions from cloud to edge. Wiwynn's end-to-end capabilities span server design, system integration, and high-volume L10/L11 rack delivery, backed by a manufacturing network spanning Taiwan, the United States, Mexico, Malaysia, and the Czech Republic.

For more information, please visit Wiwynn website, Facebook and Linkedin

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SOURCE Wiwynn