Wiwynn Corporation

Presenting AI Compute, Liquid Cooling, Optical Scale-Up, and HVDC Power Delivery

TAIPEI, May 25, 2026 /PRNewswire/ -- Wiwynn (6669), an innovative cloud IT infrastructure provider for data centers, today announced to showcase its vision of next-generation data center designs at Computex 2026 (Booth #J0106, TaiNEX1). The exhibition spans cutting-edge rack-scale AI servers, developed with Wistron, breakthrough cooling technologies, optical scale-up designs, and high voltage DC (HVDC) power delivery architectures.

"AI is no longer just a compute challenge. It's a full-system engineering challenge. Compute, thermal management, data transmission, and power delivery must be co-designed at rack scale," said William Lin, President and CEO of Wiwynn. "At Computex, Wiwynn and our ecosystem partners present a full-stack, rack-scale technology blueprint, demonstrating our commitment to system design and integration excellence for data centers and cloud service providers worldwide."

Powering the AI Factory: Next-Generation AI Compute and Storage Systems

• NVIDIA Vera Rubin NVL72: Wiwynn and Wistron are among the first in line with readiness for the fully liquid-cooled, rack-scale platform unifying 72 NVIDIA Rubin GPUs and 36 NVIDIA Vera CPUs. Optimized for frontier AI model training, inference and reasoning, the platform delivers up to 10X higher performance per watt through extreme co-design —delivering breakthrough performance and efficiency for AI factories.
• AMD Helios rack-scale solution: Built on the OCP ORv3 Open Rack Wide (ORW) specification and powered by AMD Instinct™ MI400 Series GPUs, 6^th gen AMD EPYC™ CPUs, AMD Pensando™ networking technologies and the unifying AMD ROCm™ software stack, this pioneering AI platform is purpose-built for the world's most demanding workloads. Its open rack design enables superior power density, streamlined scaling, and simplified serviceability. As a trusted ODM partner, Wiwynn brings the AMD Helios platform from reference design to production, accelerating open, interoperable AI infrastructure for the next-generation hyperscale AI deployments.
• Storage: A storage server prototype providing aggregate high IOPs from 96 liquid-cooled E3.S SSDs, accessed with NVIDIA SCADA, using NVIDIA GPUs capable of saturating the PCIe connections to the drives for GNN and vector databases.

Rethinking Power: High Voltage DC (HVDC) Power Distribution:

As rack power density escalates, HVDC is becoming a foundational shift in data center architecture. Wiwynn, together with key ecosystem partners Delta and TE Connectivity (TE), showcases a rack level 800 VDC solution, spanning the power rack, liquid-cooled busbar, and an 800V-to-50V power distribution board (PDB), demonstrating the end-to-end HVDC system integration for high-density AI deployments.

Beyond Copper: Optical AI Scale-up with Co-Packaged Optics (CPO):

Bandwidth bottlenecks are the next frontier in AI infrastructure. Wiwynn collaborates with ecosystem partners, including Ayar Labs and GUC, to demonstrate a CPO-based optical scale-up rack design, integrating AI ASIC with 2.5D advanced package, TeraPHY™ optical engines, ELSFP SuperNova™ remote light sources, advanced fiber routing and optical interconnects. Wiwynn will also highlight its in‑house liquid‑cooling solution, purpose-built for ELSFP, ensuring reliable in‑chassis optical connections. This end-to-end demonstration marks a critical milestone in transitioning CPO from component-level innovation to hyperscale-ready deployment.

Breaking Thermal Barriers: Advanced Cooling innovation

As chip power envelopes reach new extremes, Wiwynn introduces two breakthrough cooling technologies:

• 6kW Double-sided Cold Plate with Liquid Metal TIM: Designed to support AI ASICs up to 6kW, this ultra-thin, double-sided liquid cooling solution integrates cavity PCB architecture to support Vertical Power Delivery (VPD), shorten power delivery paths and improve power delivery efficiency by more than 80% in a compact environment. With Liquid Metal TIM significantly reducing silicon-to-cold plate temperature differentials, the solution delivers over 30% gains in thermal efficiency.
• Diamond Composite Cooling: Wiwynn pushes material science boundaries with diamond composite, a next-generation thermal material offering superior thermal conductivity and a weight advantage over copper. Demonstrated in a microchannel cold plate design, diamond composite enhances cooling performance, addressing both thermal and structural challenges in high-density AI deployments, while unlocking promising potential for future IC package-level cooling applications.

Visit Wiwynn @Computex 2026 (Booth #J0106, TaiNEX1) to explore these innovative solutions driving the future of AI infrastructure and data center technologies.

About Wiwynn

Wiwynn is an innovative cloud IT infrastructure provider delivering high-quality computing, storage, and rack-level solutions for leading data centers worldwide. Guided by the vision to "unleash the power of digitalization; ignite the innovation of sustainability," Wiwynn actively invests in next-generation technologies to deliver the best TCO, workload- and energy-optimized IT solutions from cloud to edge. Wiwynn's end-to-end capabilities span server design, system integration, and high-volume L10/L11 rack delivery, backed by a manufacturing network spanning Taiwan, the United States, Mexico, Malaysia, and the Czech Republic.

For more information, please visit Wiwynn website, Facebook and Linkedin

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SOURCE Wiwynn

SAN JOSE, Calif., March 16, 2026 /PRNewswire/ -- Wiwynn, an innovative cloud IT infrastructure provider, is showcasing the latest NVIDIA-powered AI solutions, developed in collaboration with Wistron, at GTC 2026 (Booth # 1121). From board-level innovation to rack-scale integration and validation, Wiwynn's end-to-end expertise in accelerated computing, storage, and liquid cooling delivers future-ready AI factories with breakthrough performance, exceptional energy efficiency, and faster time-to-value.

"As AI accelerates, customers need a trusted partner to rapidly build out integrated, rack-scale solutions that harmonize compute, storage, networking, and liquid cooling," said William Lin, President and CEO at Wiwynn. "With end-to-end integration capability and manufacturing excellence, Wiwynn brings the latest platforms and innovations powered by NVIDIA to market faster—unlocking performance-per-watt gains and building a robust AI infrastructure layer that keeps customers at the forefront of the AI era."

Technology highlights

• NVIDIA Vera Rubin NVL72: Wiwynn and Wistron are among the first in line with readiness for the fully liquid-cooled, rack-scale platform unifying 72 NVIDIA Rubin GPUs and 36 NVIDIA Vera CPUs. Optimized for frontier AI model training, inference and reasoning, the platform delivers up to 10X higher performance per watt through extreme co-design —delivering breakthrough performance and efficiency for AI factories.
• NVIDIA HGX Rubin NVL8: A top-tier modular accelerated computing platform—a fanless, high-density 2U system with eight NVIDIA Rubin GPUs and 100% liquid cooling to achieve remarkable PUE. Scales from 8 to 16 systems per rack over NVIDIA Spectrum-X Ethernet or NVIDIA Quantum-X800 InfiniBand, adapting to evolving compute needs at scale.
• NVIDIA RTX PRO Server: A compact 2U Arm-based platform that pairs dual NVIDIA Vera CPUs with two NVIDIA RTX PRO 4500 Blackwell Server Edition GPUs (32GB GDDR7 each) to power neural rendering and AI-driven design.
• Storage-Next: Part of NVIDIA's Storage-Next initiative, the GPU-initiated storage architecture leverages NVIDIA SCADA to directly orchestrate I/O across a 96-drive NVMe array via the GPU, delivering ultra-high IOPS, sub-millisecond tail latencies and petabyte-class density for GNN, LLM inference, and RAG. Direct liquid cooling, integrated per-drive telemetry and multi-zone leak detection enable high efficiency and hot-serviceability.

Session at GTC 2026

• Topic: Build an AI-Ready Data Center: Practical Insights from YTL, Wiwynn, and NVIDIA
• March 19, 2026, 10:00–10:40 a.m. PT
• A deep dive into L11–L12 co-engineering—from rack delivery to cluster acceptance—accelerating deployments and optimizing thermals, power, and serviceability.

"The next generation of AI innovation will run on rack-scale accelerated computing platforms designed for extreme performance and efficiency," said Kaustubh Sanghani, vice president of product management at NVIDIA. "With deep expertise in liquid-cooled infrastructure and rack-scale system integration, Wiwynn is bringing the power of the NVIDIA Vera Rubin platform to data centers worldwide—enabling customers to build AI factories that can scale training and inference for the agentic AI era."

About Wiwynn

Wiwynn is an innovative cloud IT infrastructure provider delivering high-quality computing, storage, and rack-level solutions for leading data centers worldwide. Guided by the vision to "unleash the power of digitalization; ignite the innovation of sustainability," Wiwynn actively invests in next-generation technologies to deliver the best TCO, workload- and energy-optimized IT solutions from cloud to edge. Wiwynn's end-to-end capabilities span server design, system integration, and high-volume L10/L11 rack delivery, backed by a manufacturing network spanning Taiwan, the United States, Mexico, Malaysia, and the Czech Republic.

For more information, please visit Wiwynn website, Facebook and Linkedin

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SOURCE Wiwynn