Taiwan IC Packaging Corporation

Taiwan IC Packaging Corporation is a leading technology company specializing in integrated circuit (IC) packaging solutions. Established in 1998 and headquartered in Kaohsiung, Taiwan, the company focuses on the development of advanced optical and ultrathin IC packaging technologies. Its extensive product portfolio includes lead-frame packages such as thin small outline, small outline, SSOP/TSSOP, quad flat, and LQFP, as well as quad flat no lead and dual flat no lead configurations. Additionally, the company offers substrate-based packages, including LGA, VLGA, and flash memory card formats like micro-SD and SD cards. Taiwan IC Packaging Corporation supports a wide array of end markets, with its solutions utilized across consumer electronics, computer peripherals, power management, communication devices, and mobile technology. Serving clients in Taiwan, the Americas, and Asia, the company plays a vital role in the global semiconductor supply chain by ensuring reliable interconnection and protection for semiconductor devices, which are crucial components in modern electronic equipment.