Chipbond Technology Corporation

Chipbond Technology Corporation is a leading provider of semiconductor packaging and testing services, specializing in the manufacture and processing of driver integrated circuits (ICs). Established in 1997 and headquartered in Hsinchu, Taiwan, Chipbond is recognized as the world’s largest display driver IC packaging and testing facility, maintaining a prominent position among the top ten global semiconductor packaging companies. The company’s core offerings include gold, solder, and copper bumping, redistribution layer services, wafer-level chip scale packaging, as well as advanced wafer processing such as grinding and dicing. Chipbond serves diverse technological sectors through its flexible contract manufacturing model, enabling solutions for display technologies, wireless communication, power management, automotive electronics, and biomedicine. Its business extends to compound semiconductors, providing expertise in SiGe, GaAs, GaN, and SiC packaging. This breadth of capabilities makes Chipbond Technology Corporation an essential downstream partner in the supply chain for both Taiwan’s high-tech industries and international markets, enabling innovation and reliability across a wide range of electronic applications.