SK hynix Inc.

• SK hynix to participate in 'GTC 2026' in San Jose, March 16-19
• Exhibition themed 'Spotlight on AI Memory' to unveil full lineup of AI memory solutions
• Key executives, including SK Chairman Chey Tae-won and SK hynix CEO Kwak Noh-jung, to attend and expand global AI collaborations

SEOUL, South Korea, March 17, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today that it is participating in GTC 2026, held from March 16 to 19 in San Jose, California. 

NVIDIA GTC is the global AI conference where business leaders and developers gather to share the latest breakthroughs and future trends in AI and accelerated computing.

SK hynix memory solutions are designed to minimize data bottlenecks and maximize performance for both AI training and inference in NVIDIA AI infrastructure. Through its participation in GTC 2026, the company plans to demonstrate its competitive edge in memory technology — the core infrastructure of the AI era.

Under the theme 'Spotlight on AI Memory,' SK hynix will feature an exhibition space dedicated to the AI memory technologies and solutions. The booth will consist of three main areas: the NVIDIA Collaboration Zone, the Product Portfolio Zone, and the Event Zone. The exhibition is designed around interactive content to provide visitors with an intuitive understanding of AI memory technology.

The NVIDIA Collaboration Zone, located at the entrance, is the centerpiece of the exhibition, highlighting the synergy between SK hynix and NVIDIA. The company will display the memory configuration mounted on GPU-based AI accelerators through physical models and actual hardware, focusing on the actual application of SK hynix's memory products such as HBM4, HBM3E, and SOCAMM2 designed for NVIDIA AI platforms.

Notably, the company will showcase a liquid-cooled eSSD developed in collaboration with NVIDIA, along with an NVIDIA DGX Spark, desktop AI supercomputer equipped with SK hynix's LPDDR5X.

In the Product Portfolio Zone, visitors can view a comprehensive lineup of memory products engineered for the AI era. This includes the infrastructure-essential HBM4 and HBM3E, as well as high-capacity server DRAM modules, LPDDR6, GDDR7, eSSD, and Automotive Solutions.

An interactive environment allows visitors to use joysticks to select products and view specific features and use cases on-screen, enabling them to explore and understand the technology at their own pace.

The Event Zone offers a hands-on experience with an 'HBM 16-High Stacking Game.' By virtually stacking memory chips, participants can gain insight into the TSV (Through Silicon Via) process and high-stack packaging technology, fostering a deeper understanding of how high-performance AI semiconductors are manufactured.

Throughout GTC 2026, SK hynix plans to explore future collaboration strategies aligned with current global AI trends. Key executives, including SK Chairman Chey Tae-won and SK hynix CEO Kwak Noh-jung, will meet with global tech giants to share insights on AI evolution and infrastructure shifts while discussing long-term strategic partnerships.

The company will also host technical sessions to discuss the future of AI-driven manufacturing and the pivotal role of memory technology in achieving high-performance AI.

SK hynix highlighted that as AI technology evolves, memory is transcending its role as a mere component to become a core element that determines the architecture and performance of the entire AI infrastructure. By applying its memory expertise across the entire AI spectrum — from data centers to on-device applications — the company aims to shape the future of AI alongside its global partners.

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world's top-tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM") and flash memory chips ("NAND flash") for a wide range of distinguished customers globally. The Company's shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

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SOURCE SK hynix Inc.

-    SK hynix and Sandisk form a joint workstream under OCP to start standardization 

-    New memory layer between HBM and SSD to secure scalability and power efficiency in AI inference infrastructure

SEOUL, South Korea, Feb. 25, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) and Sandisk Corporation held 'HBF Spec. Standardization Consortium Kick-Off' event at Sandisk Headquarters in Milpitas, California on the 25^th(local time) announcing global standardization strategy of next-generation memory solution HBF(High Bandwidth Flash) aimed at the AI inference era.

SK hynix said, "By making HBF an industry standard, together with Sandisk, we will lay the foundation for the entire AI ecosystem to grow together. A dedicated workstream under OCP^[1] will be launched with Sandisk to begin standardization work."

Recently, the AI industry is shifting from training which focuses on creating Large Language Models (LLMs) to inference, which accelerates actual AI services to users.

Fast and efficient memory is essential as the number of users using AI services increases rapidly. However, the existing memory structure cannot meet the high capacity data processing and power efficiency at the same time in the inference stage and HBF technology is designed to address these limitations.

HBF technology is a new memory layer between ultra-fast memory, HBM and high-capacity storage device, SSD. HBF technology can fill the gap between HBM's high performance and SSD's high capacity and ensure both capacity expansion and power efficiency required for AI inferencing. While HBM handles the high level bandwidth, HBF technology serves as a supporting layer in the architecture.

In particular, HBF technology is expected to reduce the total cost of ownership (TCO) while increasing the scalability of AI systems. The industry forecasts that the demand of complex memory solutions, including HBF, will pick up around 2030.

In the AI inference market, the role of a total memory solution company that can provide both HBM and HBF is becoming more important as system level optimization of CPU, GPU, and memory determines the overall competitiveness rather than the performance of a single chip.

In line with this, SK hynix and Sandisk are proactively pursuing HBF solution's standardization and commercialization based on their design, packaging and mass production experience in HBM and NAND.

"The key to AI infrastructure is to go beyond the performance competition of individual technologies and to optimize the entire ecosystem," said Ahn Hyun, President and Chief Development Officer. "Through HBF technology standardization the company will establish a cooperative system and present an AI-era optimized memory architecture to create new value for customers and partners."

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world's top-tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM") and flash memory chips ("NAND flash") for a wide range of distinguished customers globally. The Company's shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxembourg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

View original content:https://www.prnewswire.com/news-releases/sk-hynix-and-sandisk-begin-global-standardization-of-next-generation-memory-hbf-302697687.html

SOURCE SK hynix Inc.