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WUXI, China, June 5, 2026 /PRNewswire/ -- In foldable smartphones, the ultimate competitive frontier is no longer the display itself—but the microscopic support structures hidden beneath it. Recently, Wuxi Lead Intelligent Equipment Co., Ltd. (hereafter referred to as Lead Intelligent) partnered with global device manufacturer OPPO to jointly advance a breakthrough manufacturing solution: the cross-industry introduction of chip-level 3D printing technology into the production of foldable smartphone hinge structures.
This foundational innovation—one that moves beyond the limits of conventional mechanical machining—has become a core enabling technology supporting the "crease-free folding" experience targeted for the OPPO Find N6. At the same time, it opens new possibilities for precision manufacturing across the global consumer-electronics industry.
Crossing a Microscopic Manufacturing Threshold
When Conventional Machining Approaches Its Physical Limits
In recent years, foldable smartphones have entered a phase of rapid global expansion. Yet the visible screen crease remains one of the most persistent barriers to improving user experience.
Why is the crease so difficult to eliminate? Within the extremely constrained structural space of a foldable smartphone, even micron-level dimensional deviations that are invisible to the naked eye can accumulate after thousands of folding cycles and ultimately manifest as visible surface deformation on the display.
Traditional machining and polishing processes are now approaching their physical precision limits, making further step-change improvements in surface flatness increasingly difficult to achieve.
To overcome this industry-wide microscopic constraint, Lead Intelligent and OPPO moved beyond conventional process pathways by introducing a micron-scale additive manufacturing solution—a technology typically reserved for semiconductor and chip fabrication environments.
Using this approach, key hinge components can be reconstructed at the micron scale, enabling the deposition of an ultra-uniform polymer support layer precisely matched to the hinge surface geometry. This engineered micro-support structure provides controlled stress release during repeated folding cycles, creating the mechanical foundation required for a genuinely crease-minimized folding experience and marking an important step toward the next generation of foldable-device structural design.
Industrial Synergy
Driving the Evolution of Advanced Manufacturing Through Foundational Innovation
Lead Intelligent's ability to precisely control the microscopic spreading behavior of single-layer polymer materials across hinge substrates reflects long-term technological accumulation in high-end equipment engineering and precision manufacturing. It also represents the outcome of deep collaborative engagement with OPPO across product architecture and structural-design development.
Together, the two companies overcame major technical barriers in ultra-high-precision three-dimensional contour detection and hardware integration. Through thousands of rounds of joint optimization across critical process parameters, the partners ultimately enabled this advanced manufacturing technology to achieve scalable validation in real commercial production scenarios, marking a decisive transition from proof-of-concept capability to industrial deployment.
By challenging conventional manufacturing boundaries and seeking solutions at the microscopic scale, the collaboration between Lead Intelligent and OPPO represents more than a targeted engineering upgrade addressing foldable-device hinge performance. It signals a broader step forward in China's capabilities in foundational materials engineering and precision manufacturing technologies.
Looking ahead, Lead Intelligent will continue advancing into the most technically demanding frontiers of advanced manufacturing, deepening collaboration with leading partners across the industrial value chain and accelerating the transition of next-generation laboratory-stage technologies into high-end industrial applications. Through these efforts, Lead Intelligent aims to provide a stronger technological foundation supporting collaborative innovation across the global advanced-manufacturing ecosystem.
View original content:https://www.prnewswire.co.uk/news-releases/lead-intelligent-O-oppo-enabling-the-crease-free-folding-breakthrough-through-chip-level-precision-manufacturing-302792421.html
WUXI, China, May 13, 2026 /PRNewswire/ -- On May 13, during CIBF 2026 in Shenzhen, Lead Intelligent, a global leader in intelligent manufacturing solutions for new energy industries, officially signed a strategic cooperation agreement with the Beijing Humanoid Robot Innovation Center, China's national-level embodied intelligence innovation platform.
Leveraging LEAD's deep expertise in industrial intelligent manufacturing and the Innovation Center's cutting-edge embodied intelligence technologies, the two parties will jointly accelerate the large-scale deployment of humanoid robots from laboratories to real world industrial production lines, reshaping the future of new energy and advanced manufacturing industries.
Mr. Wang Lei, CEO of LEAD Group, and Mr. Xue Ming, CMO of the Beijing Humanoid Robot Innovation Center, attended the signing ceremony alongside company representatives.
As global intelligent manufacturing enters a new phase of transformation, embodied intelligence and human-machine collaboration are emerging as key directions of next-generation industrial upgrades. Traditional manufacturing is rapidly evolving toward greater intelligence and flexibility, while the new energy industry—with its complex processes and demanding operating environments—faces increasing demand for highly adaptable intelligent systems capable of replacing repetitive and high-risk manual tasks. With their human-like mobility and operational flexibility, humanoid robots are becoming a critical breakthrough technology for addressing these challenges.
With years of experience in advanced manufacturing for the new energy industry, Lead Intelligent has built comprehensive expertise across the entire industrial chain, including equipment technologies, integrated process experience, and large-scale industrial application scenarios. The company possesses strong capabilities in production line integration and large-scale delivery, with deep insights into real-world manufacturing pain points.
Founded in November 2023, the Beijing Humanoid Robot Innovation Center was officially designated in October 2024 by China's Ministry of Industry and Information Technology and the People's Government of Beijing Municipality as the "National and Local Co-Built Embodied Intelligence Robot Innovation Center." As China's first innovation center focused on embodied intelligent robotics, it possesses industry-leading capabilities of humanoid robots, underlying hardware and software architectures, and full-stack core technologies of the embodied large models.
With highly complementary strengths and closely aligned strategic visions, the partnership marks the beginning of a new era of "Intelligent Equipment + Humanoid Robots." Moving forward, the two sides will focus on deep collaboration in four key areas:
1. Scenario Integration to Accelerate Industrial Deployment
The partnership will focus on real-world new energy manufacturing scenarios, developing integrated "advanced equipment + humanoid robot" solutions to bring embodied intelligence onto production lines and expand its applications across advanced manufacturing. This includes enabling human-robot collaboration throughout production logistics, equipment operation, and maintenance processes.
2. Digital Intelligence Infrastructure to Strengthen the Industrial Foundation
The two parties will jointly establish industrial data collection centers and intelligent iteration systems tailored for general industrial and new energy applications. By leveraging massive on-site process action databases together with embodied large models and machine vision technologies, humanoid robots will be trained through imitation learning and generalized training to meet stringent industrial requirements for precision, cycle time, and stability.
3. Standardization Leadership to Build an Industry Ecosystem
The collaboration will also promote the joint development of industry standards for humanoid robot software and hardware, helping close existing standardization gaps while establishing platforms for technological innovation and industrial services. Together, the two parties aim to drive the standardized, scalable, and ecosystem-oriented development of the embodied intelligence industry.
4. Advanced Equipment Empowerment to Accelerate Mass Production
Leveraging Lead Intelligent's strengths in advanced turnkey equipment and intelligent manufacturing systems, the partnership will accelerate the mass production and commercialization of humanoid robots and their core components, using industrial manufacturing capabilities to further empower the development of embodied intelligence industry.
Looking ahead, Lead Intelligent and the Beijing Humanoid Robot Innovation Center will continue pushing the boundaries between intelligent manufacturing and embodied intelligence through technological innovation. Together, they aim to equip every advanced production line with a "smart brain" and "dexterous hands," opening a new era of human-robot collaboration and intelligent co-existence in advanced new energy manufacturing.
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SOURCE Wuxi Lead Intelligent Equipment Co., Ltd.