Jcet Group Co., Ltd.

Jcet Group Co., Ltd. is a prominent entity in the semiconductor industry, engaging in the provision of a wide range of integrated circuit (IC) backend packaging and test services. As a leading provider, the company operates a comprehensive portfolio that covers advanced packaging solutions, including wafer bumping, chip-scale packaging, and through-silicon via (TSV) technology. These solutions are crucial for enhancing the performance and efficiency of electronic devices. Jcet Group Co., Ltd. plays a critical role in supporting industries such as consumer electronics, telecommunications, automotive, and computing by enabling the miniaturization and integration of complex circuitry. With its strategic focus on innovation and quality, the company contributes significantly to the semiconductor supply chain, facilitating the global demand for advanced electronic components. Headquartered in China, Jcet Group Co., Ltd. has established itself as a key player in the international semiconductor market, marked by its commitment to technological advancement and customer-centric service offerings.