Flex Ltd

Prefabricated modular solutions integrate power, compute and cooling to cut deployment timelines by up to 30%

News summary

• Modular solutions combine Flex's advanced manufacturing scale and systems integration expertise with NVIDIA AI infrastructure
• Feature 800 VDC Power Rack, high-density IT racks, advanced liquid cooling and critical power infrastructure
• Leverage Flex's extensive global footprint, including 18+ million square feet across 35+ locations in the Americas, to meet growing AI infrastructure demands in the U.S.

SAN JOSE, Calif., March 16, 2026 /PRNewswire/ -- Flex (NASDAQ: FLEX) today announced new reference designs for NVIDIA Omniverse DSX Blueprint to accelerate giga-scale AI factory deployment. Built under Flex's AI Infrastructure Platform, the prefabricated modular designs combine power, high-density IT racks and cooling into factory-integrated systems engineered for speed, scalability and system-level performance.

"Speed and manufacturing scale now define competitive advantage in AI infrastructure," said Michael Hartung, President and Chief Commercial Officer at Flex. "These reference designs bring together Flex's advanced manufacturing footprint and integration expertise with NVIDIA's AI-driven platform leadership. By engineering the full infrastructure stack as a unified system, we help customers overcome the power, heat and scale challenges of the AI era and bring capacity online faster."

The reference designs feature hybrid architectures that support phased migration from traditional AC environments to 800 VDC power architectures. Pre-engineered and factory-built modular systems reduce on-site complexity and enable up to 30% faster deployment compared to traditional construction approaches.

At the core of the reference designs are several new innovations:

• 800 VDC Power Rack – Developed in collaboration with NVIDIA, the 800 VDC Power Rack features a disaggregated architecture and Flex's power shelf for the NVIDIA Vera Rubin platform. By shifting power components outside the IT rack, the design maximizes space for compute, enabling higher GPU density, improved communication and greater performance per rack.
• Advanced liquid cooling – Secondary fluid networks and centralized cooling distribution units (CDUs) enable efficient heat removal to support power-intensive AI workloads.
• Integrated IT racks – High-density, liquid-cooled racks house AI servers along with integrated networking and high-speed interconnects to support low-latency, high-bandwidth communication.
• Critical power infrastructure – Dedicated high-capacity power feeds, redundant busway systems with rack-level tap-offs, and integrated power distribution cabinets and units provide scalable, reliable power delivery across the deployment.

Flex is actively building prefabricated modular solutions for hyperscalers today, including at its 400,000-square-foot Dallas facility purpose-built for data center infrastructure. With more than 18 million square feet across 35+ locations in the Americas — including Austin, Texas and Guadalajara, Mexico — Flex's scale and regional presence significantly shorten lead times for U.S. data center operators.

To learn more about Flex's reference designs and AI infrastructure platform, visit: https://flex.com/resources/flex-ai-infrastructure-platform

Media contacts

Media & Press 

Christie Haber  

Director, Commercial Marketing  

(602) 245-1057  

press@flex.com  

Investors & Analysts

Michelle Simmons

Senior Vice President, Global Investor Relations and Public Relations

(669) 242-6332

Michelle.Simmons@flex.com

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SOURCE Flex

AUSTIN, Texas, March 11, 2026 /PRNewswire/ -- JetCool, a Flex (NASDAQ: FLEX) company and a leading provider of end-to-end liquid cooling solutions for high-density compute, today announced it has collaborated with Broadcom to deliver liquid cooling for next-generation AI XPUs, backed by Flex's global mass production capabilities.

As AI training and inference workloads accelerate, silicon power densities are advancing into sustained multi-kilowatt ranges per device. Thermal architecture now directly impacts system performance, long-term reliability, and deployment timelines. Through this collaboration, JetCool has developed a single-phase direct-to-chip cooling solution designed to integrate with Broadcom's mechanical and thermal reference architecture, enabling sustained multi-kilowatt ASIC operation at heat flux levels of 4 W/mm² per device.

By aligning silicon design, advanced packaging, mechanical integration, and thermal engineering early in development, Broadcom and JetCool are enabling AI platforms engineered for performance and repeatable manufacturing. Combining JetCool's direct-to-chip liquid cooling, Flex's global manufacturing scale, and Broadcom's custom AI silicon expertise, the partnership establishes a production-ready thermal foundation for hyperscale AI infrastructure.

"At Broadcom, we design AI systems to lead at hyperscale," said Ken Kutzler, VP of AI Systems Development for Broadcom's ASIC Products Division. "Supporting multi-kilowatt ASIC platforms requires a tight coordination across silicon architecture, advanced packaging, power delivery, and thermal engineering. Our partnership with JetCool, combined with Flex's manufacturing and integration capabilities, provides a clear path from advanced ASIC innovation to high-volume AI XPU deployment."

"Cooling has become a primary design constraint for next-generation AI silicon," said Bernie Malouin, PhD, VP, Liquid Cooling at Flex. "JetCool's advanced direct-to-chip cold plate technology, combined with Flex's global manufacturing scale, enables production-ready thermal solutions engineered for high-density silicon architectures. We've developed a strong partnership with the Broadcom team, and together we're advancing scalable thermal solutions for the next generation of AI infrastructure."

The partnership supports AI systems that:

• Deliver sustained multi-kilowatt-class performance for high-density ASIC platforms through advanced direct-to-chip liquid cooling
• Enable high-volume manufacturing through Flex's global scale
• Support future AI silicon generations as power densities continue to increase

Broadcom maintains a broad ecosystem of partners supporting diverse cooling approaches and deployment models. As part of this ecosystem, JetCool is working closely with Broadcom to advance high-performance direct-to-chip thermal architectures for next-generation AI platforms. JetCool provides end-to-end liquid cooling infrastructure from cold plates and manifolds to coolant distribution units (CDUs) supported by Flex's global manufacturing capabilities to enable scalable deployment across hyperscale AI environments.

About Flex

Flex (Reg. No. 199002645H) is the manufacturing partner of choice that helps a diverse customer base design and build products that improve the world. Through the collective strength of a global workforce across 30 countries and responsible, sustainable operations, Flex delivers technology innovation, supply chain, and manufacturing solutions to diverse industries and end markets.

About JetCool

JetCool, a Flex company, is a global leader in advanced thermal management for compute-intensive applications. Trusted by top chipmakers, OEMs, and data centers, JetCool delivers a comprehensive portfolio of liquid cooling solutions that enhance performance, increase energy efficiency, and support sustainability goals. Engineered for the demands of artificial intelligence (AI) and next-generation computing, JetCool's liquid cooling technologies deliver reliable, scalable, and future-ready performance for data centers worldwide.

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SOURCE Flex