Disco Corporation

Disco Corporation is a Japanese manufacturer specializing in precision cutting, grinding, and polishing equipment for the semiconductor and electronics industries. Headquartered in Tokyo, it develops and supplies dicing saws, grinders, laser saws, and related tools that are used to process silicon wafers, electronic components, and advanced materials with high accuracy. The company’s systems support critical steps in semiconductor fabrication, including wafer thinning, singulation, and surface finishing, helping customers achieve fine geometries and tight tolerances. Disco Corporation also provides consumables such as blades and grinding wheels, along with maintenance, training, and technical support services. Its solutions are used by semiconductor manufacturers, outsourced assembly and test providers, and producers of electronic components and optical devices. By enabling high-precision, high-yield processing of hard and brittle materials, Disco Corporation plays a significant role in the supply chain for integrated circuits, sensors, and other miniaturized electronic products used across consumer, automotive, industrial, and communications markets.